We are building the next generation of silicon wafer manufacturing in the United States. Our mission is to deliver high-purity, precision-engineered 300mm silicon wafers to meet the growing demand from advanced semiconductor fabs.
With a planned 400,000 sq ft facility in Connecticut—including 200,000 sq ft of ISO-certified cleanroom space—we aim to produce 200,000–250,000 wafers. Our wafers will support cutting-edge nodes at 5nm and below, with the surface quality, flatness, and dimensional control required by Tier-1 fabs.
As we lay the foundation for U.S.-based production, our team is focused on strategic planning, resource acquisition, and building strong partnerships with technology leaders, investors, and equipment suppliers. We are committed to strengthening the domestic semiconductor supply chain—one wafer at a time.