Precision-Engineered 300mm Silicon Wafers for Advanced Semiconductor Fabs
U.S.-Based Manufacturing of Prime Grade 300mm Silicon Wafers
Precision wafers for advanced semiconductor fabs, built for scale and built for the future.
U.S.-based manufacturing
Our facility in Connecticut strengthens the domestic semiconductor supply chain by providing a reliable, high-quality source of 300mm silicon wafers. With local production, we reduce dependence on overseas suppliers, shorten lead times, and ensure greater control over quality and logistics.
High-volume, high-precision wafer production
Designed for scale and precision, our facility will produce 475,000 300mm wafers per month with strict dimensional and surface quality control. Our advanced processes ensure each wafer meets the exacting standards required by leading-edge semiconductor fabs.
Future-ready for Tier-1 fabs (TSMC, Intel, etc.)
Our wafers are engineered to meet the stringent specifications of the world’s most advanced semiconductor manufacturers. With tight tolerances, ultra-flat surfaces, and contamination control, we’re building a supply chain foundation capable of supporting Tier-1 fabs at 5nm and beyond. Our facility is designed with future growth in mind, allowing us to scale capacity as demand increases.
Our Product Lines
300mm wafers engineered for advanced semiconductor fabs, across three core product lines.
Prime Polished
Double-side polished wafers conforming to SEMI M1, built for front-end device fabrication.
Epitaxial
Wafers with a controlled epitaxial layer conforming to SEMI M62, for precise resistivity and defect control.
Argon-Annealed, COP-Free
Annealed per SEMI M57 to minimize crystal-originated particles near the surface.
Current Roadmap
We are in the early stages of developing our facility. Construction is planned to begin in early 2027 and run approximately 23 months, with first production of 300mm wafers targeted for early 2029 and full ramp to 475,000 wafers per month by late 2029.
North East Wafers 